
(footprint MODULE_ESP32-C3-WROOM-02-H4 (layer F.Cu) (tedit 66A5CEA0)
  (descr "")
  (attr smd)
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    (effects (font (size 1.0 1.0) (thickness 0.15)))
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    (effects (font (size 1.0 1.0) (thickness 0.15)))
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  (pad 14 smd rect (at 8.75 3.1) (size 1.5 0.9) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 15 smd rect (at 8.75 1.6) (size 1.5 0.9) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 16 smd rect (at 8.75 0.1) (size 1.5 0.9) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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  (pad 23 smd rect (at 0.96 3.3) (size 0.7 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 24 smd rect (at 2.06 3.3) (size 0.7 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 22 smd rect (at -0.14 3.3) (size 0.7 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 19 smd rect (at -0.14 2.2) (size 0.7 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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  (pad 21 smd rect (at 2.06 2.2) (size 0.7 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 27 smd rect (at 2.06 4.4) (size 0.7 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 26 smd rect (at 0.96 4.4) (size 0.7 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 25 smd rect (at -0.14 4.4) (size 0.7 0.7) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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  (fp_circle (center -10.5 -2.9) (end -10.4 -2.9) (layer F.Fab) (width 0.2))
  (zone (net 0) (net_name "") (layer F.Cu) (hatch full 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.01)
    (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints allowed))
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  (zone (net 0) (net_name "") (layer B.Cu) (hatch full 0.508)
    (connect_pads (clearance 0))
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    (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints allowed))
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)