1st bootloader won't help to initialize the MSPI & cache properly as it
usually do when loading from flash. And the ram app doesn't have valid
headers.
Since there is no enough space in 2nd bootloader, we replace the
`bootloader_init_spi_flash` in the ram_app (!pure_ram_app), with an
customized alternative of it for the ram_app.
This alternative helps to initialize the MSPI & cache properly, without
the help of 1st bootloader or image headers.
The following two functions in bootloader_support are private now:
* esp_secure_boot_verify_sbv2_signature_block()
* esp_secure_boot_verify_rsa_signature_block()
They have been moved into private header files
inside bootloader_private/
* Removed bootloader_reset_reason.h and
bootloader_common_get_reset_reason() completely.
Alternative in ROM component is available.
* made esp_efuse.h independent of target-specific rom header
When creating G0 layer, some regi2c_*.h headers were moved out from
esp_hw_support (G1) to soc (G0). In order to be consistent with that change,
move all the remaining regi2c_*.h headers to soc too.
The following files were deleted:
- components/esp_hw_support/include/soc/cpu.h
- components/soc/esp32s3/include/soc/cpu.h
The following functions are deprecated:
- get_sp()
The following functions declared in soc/cpu.h are now moved to esp_cpu.h:
- esp_cpu_configure_region_protection()
The following functions declared in soc/cpu.h are now moved to components/xtensa/include/esp_cpu_utils.h:
- esp_cpu_process_stack_pc()
All files with soc/cpu.h inclusion are updated to include esp_cpu.h instead.
Signed-off-by: Sudeep Mohanty <sudeep.mohanty@espressif.com>
1. add some efuse api to get rtc & digital voltage
2. set dig_rtc voltage to a fix value storing in efuse no mater which cpu frequency
3. modify hardware code in bootloader to fit all c3 ECO3 version
1. deepsleep poweron reset bug in high temperature before ECO3;
2. brownout reset bug before ECO2;
3. bbpll voltage low bug before ECO3;
4. need xpd iph for xtal before ECO3;
